Montreal, Canada – Future Electronics, a leading global distributor of electronic components, is announcing the availability of the Melexis Triphibian™ family of MEMS pressure sensing technology. With the new patented technology, withstanding pressures far more than 5 bar and remaining in contact with liquid media is a game changer for the automotive industry, as well as some adjacent markets.
The Triphibian™ sensing element by Melexis features a suspended cantilever within the IC package, with the membrane positioned at its tip. This unique cantilever design equalizes pressure spikes and burst levels across the entire structure, making it inherently more robust compared to back side exposed solutions, which still experience pressure differences between the glass pedestal side and the wire bonding side. Additionally, this pressure equalization capability extends to frozen media, enabling the use of MEMS in such environments for the first time.
For more information, visit www.FutureElectronics.com/resources/featured-products/melexis-triphibian-mems-pressure-sensor-technology.
